Capabilities

  • Up to 34 Layers
  • Board Size to 22” x 27.5”
  • Maximum panel size: 24” x 28”
  • Board Thickness to .250”
  • Heavy Copper: 12oz / 6oz (Inner/Outer)
  • Sequential Lamination Construction
  • Buried/Blind via (Stacked Blind Vias)
  • Minimum Line Space: 2/2 Mil (Inner & Outer Layer)
  • 16:1 Plating Aspect Ratio (PCB Thickness/Finish Hole Size)
  • Minimum Finish Hole Size .004” (both mechanical & laser drills)
  • 4 Build Up HDI (Laser Vias)
  • Aluminum Base Plate Heat Sink PCB
  • Thin core as low as .002”
  • Warpage: .005”/inch
  • Controlled impedance
  • Surface finishes available:

    • HASL
    • ENIG
    • ENEPIG
    • Selective Gold Plating
    • Immersion Silver
    • OSP
    • Carbon
    • Immersion Tin
    • Selective heavy Au
    • HASL (Lead free)
    • Wire Bonding Soft Gold
    • Hard Gold

Materials

  • FR4 Tg140°C
  • FR4 Tg150°C
  • FR4 Tg180°C
  • IT-200LK Tg200°C
  • Rogers RO4350 Core
  • Halogen Free
  • Other materials upon request

Plating Proccesses

  • Hard Gold
  • Electroless Nickel/ Immersion Gold (ENIG)
  • Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG)
  • Lead Free HASL
  • Other plating processes upon demand:

    • (HASL) Hot Air Solder Leveling
    • Organic Solderability Preservative (OSP)
    • Wire Bonding Soft Gold
    • Selective Gold
    • Immersion Silver
    • Immersion Tin

Manufacturing

  • DFM
  • Pre-Production Quantities
  • Production Runs
  • Heavy Copper Specialists
  • HDI
  • Backplane
  • ATE Boards
  • Metal Core Products
[ Personal Inspection for Quality Control ]
[ One of Our Engineers in the Process ]

Equipment List

  • Tooling Design

    • GC-CAM, Gensis 2000, InCAM, ParCAM
    • A/W Laser Plotters
    • AOI
    • A/W Inspection Machine
    • A/W Developing Machine
    • 2D Measuring Instrument
    • Polar CITS25
  • Inner Layer Processing

    • Auto Diamond Saw Cutting Machine
    • Auto D/F Laminate Line
    • Auto Roller Coating Line
    • Auto UV Exposure Machine
    • LASER Direct Image
    • Thin core pre-treatment lines
    • Thin core Dev/Etch/Strip lines
    • Heavy copper etching line
    • CCD Automatic Tooling Hole Drilling Machines
    • AOI & VRS
  • Lamination

    • CCD Tooling Hole Punch Machine
    • CCD Auto tooling Hole Drilling Machine
    • Automatic Black Oxide Line
    • Automatic Horizontal Co-bra bond line
    • Prepreg bonding machine
    • Vacuum lamination press (4H, 2C)
    • Metal & Plastic eyelet machines
    • CNC routing machines
    • X-ray targeting & drilling machines
    • Auto Loading/unloading & conveying for Lamination
    • Auto X-ray Target Measuring and Drilling Machine
  • Drilling

    • Edge Beveling Machines
    • CNC drilling machines (138 spindles)
    • Laser drilling machines (2 x 2 spindles)
    • Hole counter
  • Outer Layer Processing

    • Auto Deburr Line
    • Plasma Appl AU-16H
    • Desmear & plated thru hole line
    • 1st copper plating (panel) line
    • Vertical copper plating (panel) line
    • High aspect ratio vertical copper plating (panel) line
    • Copper filled BVH plating line
    • Automatic dry film laminators
    • Auto & semi-auto UV exposure machines
    • Dry film developing lines
    • Dry film/Etching/Stripping lines
    • 2nd Copper plating (pattern) line
    • Dry film stripping/etching/tin stripping
    • Belt sander & automatic epoxy scrubbing line
    • AOI & VRS
  • Soldermask

    • Scrubbing & cleaning machines
    • Pumice treatment line
    • Semi-auto printing machines
    • Solder mask Pre-cure line
    • Automatic UV exposure machines (4 CCD alignment)
    • Semi-auto UV exposure machines
    • Solder mask developing machines
    • Post cure lines
    • Vacuum Resin Plugging Machine
  • Legend

    • CCD automatic printing lines
    • Semi-auto printing machines
    • Automatic Curing Line
  • Carbon Ink

    • CCD automatic carbon ink printing lines
    • Automatic curing lines
  • Routing

    • CNC routing machines (54 spindles)
    • Beveling machine
    • Scoring machines
    • Final cleaning with Ultrasonic wave
    • Hole Counter
  • Electrical Testing

    • Universal testers (LMx2, CLx4)
    • Moving probe testers
    • Semi-auto dedicate testers
    • Automatic dedicate testers
  • Final Inspection

    • Automatic optical cosmetic inspection
  • Package

    • Vacuum packaging machines